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MO-100 Split-Vision SMT Placement System
Posted On 13 Aug 2013
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A high-value, affordable and stand-alone solution for the placement of hard to handle and fine pitch components in manual, prototyping or repair surface mount assembly operations, MO-100 provides high-precision placement capability for BGAs, µBGAs, CSPs, flip chips and fine pitch QFP devices up to 70 x 70 mm.